Summit Securities Group LLC Acquires Shares of 803 Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC)

Summit Securities Group LLC bought a new position in Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC) during the 4th quarter, HoldingsChannel reports. The fund bought 803 shares of the semiconductor company’s stock, valued at approximately $37,000.

Other institutional investors have also recently made changes to their positions in the company. Advisors Asset Management Inc. raised its holdings in Kulicke and Soffa Industries by 137.5% in the 3rd quarter. Advisors Asset Management Inc. now owns 715 shares of the semiconductor company’s stock worth $32,000 after acquiring an additional 414 shares during the last quarter. GAMMA Investing LLC raised its stake in shares of Kulicke and Soffa Industries by 61.0% in the fourth quarter. GAMMA Investing LLC now owns 1,021 shares of the semiconductor company’s stock worth $48,000 after purchasing an additional 387 shares during the last quarter. Signaturefd LLC lifted its holdings in shares of Kulicke and Soffa Industries by 35.5% during the fourth quarter. Signaturefd LLC now owns 1,061 shares of the semiconductor company’s stock valued at $50,000 after purchasing an additional 278 shares in the last quarter. Smartleaf Asset Management LLC boosted its position in shares of Kulicke and Soffa Industries by 397.4% during the fourth quarter. Smartleaf Asset Management LLC now owns 1,149 shares of the semiconductor company’s stock valued at $53,000 after buying an additional 918 shares during the last quarter. Finally, Public Employees Retirement System of Ohio bought a new stake in Kulicke and Soffa Industries in the 3rd quarter worth about $53,000. Hedge funds and other institutional investors own 98.22% of the company’s stock.

Kulicke and Soffa Industries Stock Down 4.2 %

Kulicke and Soffa Industries stock opened at $33.06 on Monday. Kulicke and Soffa Industries, Inc. has a 52-week low of $32.02 and a 52-week high of $53.71. The company has a market cap of $1.76 billion, a P/E ratio of 275.50 and a beta of 1.38. The business has a 50-day simple moving average of $40.04 and a two-hundred day simple moving average of $44.05.

Kulicke and Soffa Industries (NASDAQ:KLIC) last announced its earnings results on Tuesday, February 4th. The semiconductor company reported $0.27 earnings per share (EPS) for the quarter, missing the consensus estimate of $0.28 by ($0.01). Kulicke and Soffa Industries had a net margin of 0.48% and a negative return on equity of 1.26%. Research analysts anticipate that Kulicke and Soffa Industries, Inc. will post 0.93 EPS for the current fiscal year.

Kulicke and Soffa Industries Dividend Announcement

The business also recently announced a quarterly dividend, which will be paid on Tuesday, April 8th. Investors of record on Thursday, March 20th will be issued a $0.205 dividend. The ex-dividend date is Thursday, March 20th. This represents a $0.82 dividend on an annualized basis and a yield of 2.48%. Kulicke and Soffa Industries’s dividend payout ratio is currently 683.33%.

Analysts Set New Price Targets

Several research firms have issued reports on KLIC. StockNews.com upgraded shares of Kulicke and Soffa Industries from a “sell” rating to a “hold” rating in a research note on Thursday, February 6th. Needham & Company LLC restated a “buy” rating and set a $53.00 price objective on shares of Kulicke and Soffa Industries in a research report on Thursday, February 6th. Three investment analysts have rated the stock with a hold rating and three have assigned a buy rating to the stock. According to MarketBeat.com, the stock presently has an average rating of “Moderate Buy” and an average price target of $52.00.

Kulicke and Soffa Industries Profile

Kulicke and Soffa Industries, Inc designs, manufactures, and sells capital equipment and tools used to assemble semiconductor devices. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company offers ball bonding equipment, wafer level bonding equipment, wedge bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares and services for equipment.